MDSI: Signal Integrity Interconnect Fault Modeling and Testing for SoCs

✍ Scribed by Sunghoon Chun; Yongjoon Kim; Sungho Kang

• Book ID: 106384269
• Publisher: Springer US
• Year: 2007
• Tongue: English
• Weight: 299 KB
• Volume: 23
• Category: Article
• ISSN: 0923-8174
• DOI: 10.1007/s10836-006-0630-0