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MD simulation of a copper rod under thermal shock

✍ Scribed by Rong-Hou Xia; Xiao-Geng Tian; Ya-Peng Shen


Book ID
106332034
Publisher
The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences
Year
2010
Tongue
English
Weight
434 KB
Volume
26
Category
Article
ISSN
0567-7718

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πŸ“œ SIMILAR VOLUMES


Contact damage submitted to thermal shoc
✍ F. Osterstock πŸ“‚ Article πŸ“… 1993 πŸ› Elsevier Science 🌐 English βš– 652 KB

A criterion for study of the thermal shock resistance of brittle materials is derived. It makes use of the stable extension stage of Vickers indentation cracks under the action of the thermal transient stress which appears during quenching. During this stage, the relative increase in crack length ca