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Materials science and integration bases for fabrication of (Ba[sub x]Sr[sub 1âx])TiO[sub 3] thin film capacitors with layered Cu-based electrodes

✍ Scribed by Fan, W.; Kabius, B.; Hiller, J. M.; Saha, S.; Carlisle, J. A.; Auciello, O.; Chang, R. P. H.; Ramesh, R.

No coin nor oath required. For personal study only.

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Materials science and integration bases for fabrication of (Ba[sub x]Sr[sub 1âx])TiO[sub 3] thin film capacitors with layered Cu-based electrodes