Materials, Processes, and Performance of High-Wiring Density Buildup Substrate With Ultralow-Coefficient of Thermal Expansion

✍ Scribed by Yamanaka, K.; Kobayashi, K.; Hayashi, K.; Fukui, M.

• Book ID: 114607705
• Publisher: IEEE
• Year: 2010
• Tongue: English
• Weight: 967 KB
• Volume: 33
• Category: Article
• ISSN: 1521-3331
• DOI: 10.1109/tcapt.2009.2033666