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Materials for Advanced Packaging || Advanced Substrates: A Materials and Processing Perspective

✍ Scribed by Lu, Daniel; Wong, C.P.

Book ID: 120196089
Publisher: Springer US
Year: 2009
Weight: 1016 KB
Category: Article
ISBN: 0387782192
DOI: 10.1007/978-0-387-78219-5_7

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