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Magnetoresistance and Surface Roughness Study of the Initial Growth of Electrodeposited Co∕Cu Multilayers

✍ Scribed by Tóth, B. G.; Péter, L.; Bakonyi, I.


Book ID
125832096
Publisher
The Electrochemical Society
Year
2011
Tongue
English
Weight
270 KB
Volume
158
Category
Article
ISSN
0013-4651

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We have studied the influence of the Pb buffer layer thickness in the Co/Cu multilayers on the magnetoresistance of the system. Co/Cu multilayers (ML) were thermally evaporated at very low deposition rates on Si substrates covered with Pb buffer layer of different thickness (5, 10, 20, 30, 40 nm). T