✦ LIBER ✦
Lower Temperature and Shorter Curing Time of Methylsilsesquioxane for Intermetal Dielectric Application
✍ Scribed by C. T. Chua; G. Sarkar; S. Y. M. Chooi; L. Chan
- Book ID
- 110239368
- Publisher
- Springer
- Year
- 1999
- Tongue
- English
- Weight
- 61 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0261-8028
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