Low-temperature thermal graft copolymerization of 1-vinyl imidazole on fluorinated polyimide films with simultaneous lamination of copper foils

✍ Scribed by A. K. S. Ang; B. Y. Liaw; D. J. Liaw; E. T. Kang; K. G. Neoh

• Publisher: John Wiley and Sons
• Year: 1999
• Tongue: English
• Weight: 273 KB
• Volume: 74
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/(sici)1097-4628(19991107)74:6<1478::aid-app21>3.0.co;2-v

✦ Synopsis

A simple technique of thermal graft copolymerization of 1-vinyl imidazole (VIDZ) on pristine and argon plasma pretreated fluorinated polyimide (FPI) films with simultaneous lamination of copper foils was demonstrated. The simultaneous thermal grafting and lamination process was carried out in the temperature range of 80 -140°C under atmospheric conditions and in the complete absence of a polymerization initiator. Three different FPI samples of different chemical structures were employed in the present study. An optimum T-peel strength about 15 N/cm was achieved for the copper/FPI laminate. The adhesion strength, however, decreased with increasing fluorine content in the FPI film. The onset of cohesive failure occurred in the FPI film for assemblies with T-peel strength greater than 6 N/cm. The T-peel strengths are reported as a function of the argon plasma pretreatment time of the FPI films and thermal lamination temperature. The adhesion strengths were compared to that of the similarly prepared copper/polyimide (Kapton HN) laminate. Time-dependent water contact angle () measurements indicated that the surfaces of FPI films are significantly more hydrophobic and more resistant to water diffusion or hydration than the Kapton HN films. The surface compositions of the pristine FPI films, as well as the delaminated FPI films and copper foils were studied by X-ray photoelectron spectroscopy. The thickness of the graft VIDZ polymer layer was in the order of 200 nm, as derived from the cross-sectional view of the scanning electron micrograph.