Low temperature thermal expansion behavior in the Kondo system La1−xCexAl2
✍ Scribed by J. Weaver; J. E. Crow; T. Mihalisin
- Book ID
- 104626045
- Publisher
- Springer US
- Year
- 1978
- Tongue
- English
- Weight
- 295 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0022-2291
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✦ Synopsis
The thermal expansion coefficient for Lal_xCexAl2 has been measured from 4 to 50 K and compared to recent calculations based on a valence fluctuation model. The experimental results were found to be inconsistent with the predictions assuming valence fluctuations, even though the predictions of this model for the specific heat and magnetic susceptibility are in striking agreement with the measured quantities. The thermal expansion coefficient was not determined with sufficient precision to allow a quantitative comparison with prediction assuming resonant scattering-Kondo behavior.
📜 SIMILAR VOLUMES
Thermal expansion of Bi2212/Ag round wire was measured using double extensometers between 290 and 5 K. The Cu-Be extensometers with gauge length of 50 mm were directly attached to the sample and change of sample length during both cooling and warming processes was evaluated. Irreversible behavior wa