✦ LIBER ✦
Low-Temperature, Strong SiO2-SiO2Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits
✍ Scribed by Di Liang; Alexander W. Fang; Hyundai Park; Tom E. Reynolds; Keith Warner; Douglas C. Oakley; John E. Bowers
- Book ID
- 107455217
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 425 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0361-5235
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