✦ LIBER ✦
Low-temperature hermetic packaging for microsystems using Au–Au surface-activated bonding at atmospheric pressure
✍ Scribed by Yamamoto, Shin-ichi; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi
- Book ID
- 118246340
- Publisher
- Institute of Physics
- Year
- 2012
- Tongue
- English
- Weight
- 845 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0960-1317
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