✦ LIBER ✦
Low temperature double-exposed polyimide/oxide dielectric for VLSI multilevel metal interconnection : Thomas E. Wade. IEEE Trans. Components Hybrids mfg Technol.CHMT-5 (4), 516 (1982)
- Book ID
- 103278424
- Publisher
- Elsevier Science
- Year
- 1983
- Tongue
- English
- Weight
- 130 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0026-2714
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