✦ LIBER ✦
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
✍ Scribed by Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K.N.
- Book ID
- 122262278
- Publisher
- Elsevier Science
- Year
- 2014
- Tongue
- English
- Weight
- 1015 KB
- Volume
- 78-79
- Category
- Article
- ISSN
- 1359-6462
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