Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management

✍ Scribed by Rich, E.L., III; Martin, A.J.; Lengel, T.M.; Stewart, J.J.; Gallo, S.A.

• Book ID: 117872808
• Publisher: IEEE
• Year: 1990
• Tongue: English
• Weight: 808 KB
• Volume: 13
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.62573