𝔖 Bobbio Scriptorium

✦ LIBER ✦

Low temperature CMOS—a brief review : William F. Clarket al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology15(3), 397 (1992)

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 115 KB
Volume: 33
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(93)90218-n

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

The single chip versus multichip packagi

The single chip versus multichip packaging option for digital CMOS in the 1990s : Constantine A. Neugebauer et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 915 (1992)

📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 111 KB

A semi-analytical method to predict prin

A semi-analytical method to predict printed circuit board package temperatures : John N. Funk et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15 (5), 675 (1992)

📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 112 KB