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Low temperature acid catalyzed curing of melamine resin systems

✍ Scribed by Krister Holmberg

Publisher
Springer
Year
1984
Tongue
English
Weight
192 KB
Volume
11
Category
Article
ISSN
0170-0839

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## Abstract Effects of resin formulation, catalyst, and curing temperature were studied for particleboard binder‐type urea‐formaldehyde (UF) and 6 ∼ 12% melamine‐modified urea‐melamine‐formaldehyde (UMF) resins using the dynamic mechanical analysis method at 125 ∼ 160°C. In general, the UF and UMF