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Low resistance and highly reflective Cu–Ni solid solution/Ag ohmic contacts to p-GaN for flip-chip light emitting diodes

✍ Scribed by Leem, Dong-Seok ;Song, June-O. ;Kwak, J. S. ;Cho, J. ;Kim, H. ;Nam, O. H. ;Park, Y. ;Seong, Tae-Yeon


Book ID
105362722
Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
182 KB
Volume
201
Category
Article
ISSN
0031-8965

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