Abstract
This letter presents a micromachined aperture‐coupled antenna which improves antenna performances as well as simplifies a fabrication process. The SoQ (silicon‐on‐quartz) bonding and BCB (benzocyclobutene) adhesive bonding are employed for a radio frequency microelectro‐mechanical system (RF‐MEMS) packaging platform. The SoQ/BCB packaging platform makes the air cavity and the quartz substrate where the aperture‐coupled antenna is stacked. Therefore, radiation performances can be enhanced from low‐loss air/quartz substrates while a silicon substrate has almost no effects on radiation. Furthermore, the proposed method enables simultaneous integration of the antenna with the RF MEMS devices through a single packaging process. In this letter, the antenna is manufactured based on the proposed method and the fabrication process is carefully described. The s‐parameters and shear strength are measured to evaluate both of antenna and packaging performances. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 125–128, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24874