✦ LIBER ✦
Low expansivity organic substrate for flip-chip bonding : Stuwart E. Greer. IEEE Trans. Components, Hybrids, Mfg Technol.Chmt-2, (1) 140 (March 1979)
- Publisher
- Elsevier Science
- Year
- 1980
- Tongue
- English
- Weight
- 128 KB
- Volume
- 20
- Category
- Article
- ISSN
- 0026-2714
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