Liquid-rubber-modified epoxy adhesives cured with dicyandiamide. II.—Morphology and adhesion strengths
✍ Scribed by Yu-Der Lee; Shi-Kwun Wang; Wei-Kuo Chin
- Publisher
- John Wiley and Sons
- Year
- 1987
- Tongue
- English
- Weight
- 45 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
The adhesive and mechanical properties of epoxy resins modi®ed with carboxyl terminated poly(2-ethylhexyl acrylate) (CTPEHA) liquid rubber have been investigated as a function of the concentration of liquid rubber. CTPEHA was synthesized by the bulk polymerization technique. CTPEHA oligomer was prer
Curing characteristics and the curing schedule of an epoxy-terminated polymer (ETP) were investigated using diaminodiphenyl ether (DADPE), diaminodiphenyl sulfone (DADPS), diaminodiphenyl methane (DADPM), and the hardener of a commercial epoxy, two-pack Araldite (Ciba-Geigy), as curing agents. The a