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Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications

✍ Scribed by I. Dutta; R. Raj; P. Kumar; T. Chen; C. M. Nagaraj; J. Liu; M. Renavikar; V. Wakharkar


Book ID
107455602
Publisher
Springer US
Year
2009
Tongue
English
Weight
726 KB
Volume
38
Category
Article
ISSN
0361-5235

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