✦ LIBER ✦

Liquid-phase bonding of silicon nitride ceramics using Y2O3–Al2O3–SiO2–TiO2 mixtures

✍ Scribed by Fei Zhou; Jianyue Pan; Kangmin Chen

Book ID: 116730170
Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 288 KB
Volume: 58
Category: Article
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2003.09.032

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Joining of silicon nitride ceramic compo

Joining of silicon nitride ceramic composites with Y2O3–Al2O3–SiO2 mixtures

✍ Fei Zhou 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 657 KB

Interfacial reaction and joint strength

Interfacial reaction and joint strength of silicon nitride ceramic composites bonded with Y2O3–Al2O3–SiO2–Si3N4 mixture

✍ Fei Zhou; Chang-Min Suh; Seock-Sam Kim 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 336 KB

A reaction-bonded ceramic in the ZrO2-Y2

A reaction-bonded ceramic in the ZrO2-Y2O3-Al2O3-TiO2systems

✍ A. A. Dabizha; V. I. Ul'rikh; N. A. Dabizha; G. Ya. Akimov; T. P. Geller; V. V. 📂 Article 📅 1989 🏛 Springer US 🌐 English ⚖ 547 KB

Thermal aging of ceramics based on Al2O3

Thermal aging of ceramics based on Al2O3-TiO2, Al2O3-SiO2compositions

✍ N. A. Dabizha; V. S. Yakushkina; A. A. Dabizha; I. B. Smirnova; O. L. Moiseeva 📂 Article 📅 1990 🏛 Springer US 🌐 English ⚖ 459 KB

EBC development for hot-pressed Y2O3/Al2

EBC development for hot-pressed Y2O3/Al2O3 doped silicon nitride ceramics

✍ Sivakumar Ramasamy; Surendra N. Tewari; Kang N. Lee; Ramakrishna T. Bhatt; Denni 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 842 KB

Ultrarapid Transient-liquid-phase Bondin

Ultrarapid Transient-liquid-phase Bonding of Al2O3Ceramics

✍ Sung M. Hong; Christopher C. Bartlow; Thomas B. Reynolds; Joseph T. McKeown; And 📂 Article 📅 2008 🏛 John Wiley and Sons 🌐 English ⚖ 307 KB 👁 2 views

The vast majority of man-made structures, from skyscrapers to microelectronic devices, require joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. Conventional joining technologies often fail to provide these characteristics for applications involving