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Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling

✍ Scribed by S. Jacques; A. Caldeira; N. Batut; A. Schellmanns; R. Leroy; L. Gonthier


Book ID
113800598
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
512 KB
Volume
52
Category
Article
ISSN
0026-2714

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