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Lifetime Prediction and Design-for-Reliability of IC Interconnections with Electromigration Induced Degradation in the Presence of Manufacturing Defects

✍ Scribed by Xiangdong Xuan; Adit D. Singh; Abhijit Chatterjee


Book ID
106384308
Publisher
Springer US
Year
2006
Tongue
English
Weight
366 KB
Volume
22
Category
Article
ISSN
0923-8174

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