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Li—Cu Exchange in Intercalated Cu3N — With a Remark on Cu4N.

✍ Scribed by Fakhili Gulo; Arndt Simon; Juergen Koehler; Reinhard K. Kremer

Publisher
John Wiley and Sons
Year
2004
Weight
57 KB
Volume
35
Category
Article
ISSN
0931-7597

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✦ Synopsis

Abstract

For Abstract see ChemInform Abstract in Full Text.

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Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu–Pd–Ti filler metals
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A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin