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Laser interferometric measurement of polymer thin film thickness changes during processing

✍ Scribed by Katherine L. Saenger; Ho-Ming Tong

Publisher: John Wiley and Sons
Year: 1987
Tongue: English
Weight: 428 KB
Volume: 33
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1987.070330529

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✦ Synopsis

A simple interferometric technique is described for monitoring thickness changes in solution-cast polymer films as they are dried and cured. This paper follows a freshly spun solution of polyamic acid in NMP as it is converted into a cured polyimide film of 6 pm in thickness. The technique is shown to be nearly quantitative despite the effects of thermal expansion and cure-related refractive index changes.

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