✦ LIBER ✦
Laser drilling of vias in dielectric for high density multi-layer thick film circuits : T. Cocca and S. Dakesian. Solid St. Technol. p. 63 (September 1978)
- Publisher
- Elsevier Science
- Year
- 1979
- Tongue
- English
- Weight
- 127 KB
- Volume
- 19
- Category
- Article
- ISSN
- 0026-2714
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