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Laser Beam Sources as Tools in Semiconductor Processing

โœ Scribed by Opower, H.


Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
444 KB
Volume
166
Category
Article
ISSN
0031-8965

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MODELING OF SILICON WAFER VIBRATION IN S
โœ E.R. Marsh; B.J. Maher; C.L. White ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 220 KB

An investigation of the behavior of bare, unprocessed silicon wafers during their loading and transport in wafer cassettes is documented. Semiconductor process tools can generate sufficient vibration to cause the current 200-mm diameter wafers to vibrate inside the cassettes leading to particle gene