A high-purity silica was obtained from thermal decomposition of molding resin used as electronic packaging materials. The reaction was performed at high temperature and in oxidizing atmosphere. The product was suitable for reuse as inorganic filler in the production of semiconductor devices, as well
Kinetics of thermal decomposition of aseptic packages
โ Scribed by Juma Haydary, Dalibor Susa
- Book ID
- 120947775
- Publisher
- Versita
- Year
- 2013
- Tongue
- English
- Weight
- 260 KB
- Volume
- 67
- Category
- Article
- ISSN
- 0366-6352
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โฆ Synopsis
Abstract
Kinetics of thermal decomposition of aseptic packages (e.g. Tetrapak cartons) and pyrolysis of this waste in a laboratory flow reactor was studied. Three different models for the calculation of the reaction rate and the determination of apparent kinetic parameters of thermal decomposition were used. The first method assumes a two stage thermal decomposition and the kinetic parameters were determined by fitting a derivative thermogravimetric (DTG) curve to experimentally determined thermogravimetric data of whole aseptic cartons. The second method uses kinetic parameters determined by fitting DTG curves to thermogravimetric data of individual components of aseptic packages. The last method was a multi-curve isoconversion method assuming a change of kinetic parameters with the increasing conversion. All types of the determined kinetic parameters were used in a mathematical model for thermal decomposition of mini briquettes made from aseptic packages at the temperature of 650ยฐC. The model calculated also the heat conduction in the particles and it was verified by an independent set of experiments conducted in a laboratory screw type flow reactor.
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