✦ LIBER ✦
Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment
✍ Scribed by Jong-Hyun Lee; Jong-Whan Park; Dong Hyuk Shin; Yong-Seog Kim
- Publisher
- Springer US
- Year
- 2004
- Tongue
- English
- Weight
- 466 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0361-5235
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