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Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

✍ Scribed by Moo-Chin Wang; Shan-Pu Yu; Tao-Chih Chang; Min-Hsiung Hon


Book ID
116597842
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
224 KB
Volume
381
Category
Article
ISSN
0925-8388

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