Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

✍ Scribed by Moo-Chin Wang; Shan-Pu Yu; Tao-Chih Chang; Min-Hsiung Hon

• Book ID: 116597842
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 224 KB
• Volume: 381
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2004.03.095