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Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations

✍ Scribed by K. G. Mishra; R. K. Paramguru


Book ID
107452305
Publisher
The Minerals, Metals & Materials Society
Year
1999
Tongue
English
Weight
201 KB
Volume
30
Category
Article
ISSN
1543-1916

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