Joint structure in high brightness light emitting diode (HB LED) packages

✍ Scribed by Jin-Woo Park; Young-Bok Yoon; Sang-Hyun Shin; Sang-Hyun Choi

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 588 KB
• Volume: 441
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2006.09.043

✦ Synopsis

We present the transmission electron microscopy (TEM) analysis of 1.5 m-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.