Electrical and mechanical characterizati
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Yong-Sung Eom; Keonsoo Jang; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim
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Article
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2008
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Elsevier Science
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English
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For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th