✦ LIBER ✦
Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints
✍ Scribed by J. S. Kang; R. A. Gagliano; G. Ghosh; M. E. Fine
- Book ID
- 107452721
- Publisher
- Springer US
- Year
- 2002
- Tongue
- English
- Weight
- 906 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.