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I/O Clustering in Design Cost and Performance Optimization for Flip-Chip Design

✍ Scribed by Hung-Ming Chen; I-Min Liu; Wong, M.D.F.

Book ID
117907673
Publisher
IEEE
Year
2006
Tongue
English
Weight
350 KB
Volume
25
Category
Article
ISSN
0278-0070

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## Abstract We present a design of experiments (DOE) technique for microwave/millimeter wave flip‐chip characterization and optimization. Two optimization approaches, signal bump misalignment and transmission line compensation, are combined together for optimal performance for high frequency operat