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Investigations of Thick-Film-Paste Rheology for Dispensing Applications

โœ Scribed by M. Pospischil; K. Zengerle; J. Specht; G. Birkle; P. Koltay; R. Zengerle; A. Henning; M. Neidert; C. Mohr; F. Clement; D. Biro

Book ID
116425644
Publisher
Elsevier
Year
2011
Weight
391 KB
Volume
8
Category
Article
ISSN
1876-6102

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Investigation of thick film technology f
Investigation of thick film technology for microwave applications
โœ M.J. Stennes; K.D. Stephan; H. Campbell; C.P. Smith; R.M. Zilberstein ๐Ÿ“‚ Article ๐Ÿ“… 1987 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 338 KB

Recently, considerable interest has arisen in the use of thick film technology for microwave circuit applications. The thick film process can be used to fabricate microwave circuits that perform just as well as thin film counterparts in the lower-frequency region below 1 GHz, but systematic efforts