Investigations of failure mechanisms of TAB-bonded chips during thermal ageing : Elke Zakel and Herbert Reichl. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 856 (1990)

• Book ID: 103287584
• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 129 KB
• Volume: 31
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(91)90071-e