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Investigation on Thermal Contact Conductance Based on Data Analysis Method of Reliability

✍ Scribed by WANG, Zongren; YANG, Jun; YANG, Mingyuan; ZHANG, Weifang


Book ID
122936775
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
359 KB
Volume
25
Category
Article
ISSN
1000-9361

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