Investigation on the multi-voids formation during electromigration degradation in dual damascene Cu lines

✍ Scribed by Bana, F.; Arnaud, L.; Ney, D.; Wouters, Y.

• Book ID: 120531325
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 583 KB
• Volume: 112
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2012.11.028