Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging

✍ Scribed by C.W. Tan; Y.C. Chan; H.P. Chan; N.W. Leung; C.K. So

• Book ID: 108210453
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 643 KB
• Volume: 44
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2003.10.003