✦ LIBER ✦
Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications
✍ Scribed by Rajiv C. Dunne; Suresh K. Sitaraman; Shijian Luo; Yang Rao; C. P. Wong; William E. Estes; Ceferino G. Gonzalez; John C. Coburn; Mookan Periyasamy
- Publisher
- John Wiley and Sons
- Year
- 2000
- Tongue
- English
- Weight
- 248 KB
- Volume
- 78
- Category
- Article
- ISSN
- 0021-8995
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