✦ LIBER ✦
Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period
✍ Scribed by Hung, Tuan-Yu; Huang, Chao-Jen; Lee, Chang-Chun; Wang, Chin-Chun; Lu, Keng-Cheng; Chiang, Kuo-Ning
- Book ID
- 122375743
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 1012 KB
- Volume
- 107
- Category
- Article
- ISSN
- 0167-9317
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