Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

✍ Scribed by Xuesong Han; Yuanzhong Hu; Siyuan Yu

• Publisher: Springer
• Year: 2009
• Tongue: English
• Weight: 793 KB
• Volume: 95
• Category: Article
• ISSN: 1432-0630
• DOI: 10.1007/s00339-009-5097-2