Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load

✍ Scribed by Jianjun Wang; Minfu Lu; Daqing Zou; Sheng Liu

• Book ID: 114561965
• Publisher: IEEE
• Year: 1998
• Tongue: English
• Weight: 181 KB
• Volume: 21
• Category: Article
• ISSN: 1070-9894
• DOI: 10.1109/96.659510