✦ LIBER ✦

Investigation of Die Stress Profiles During Powder Compaction Using Instrumented Die

✍ Scribed by Sung-Tae Hong; Yuri Hovanski; Curt A. Lavender; K. Scott Weil

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Stresses occurring during one-sided die

✍ S. Strijbos; P.J. Rankin; R.J. Klein Wassink; J. Bannink; G.J. Oudemans 📂 Article 📅 1977 🏛 Elsevier Science 🌐 English ⚖ 865 KB

Constitutive data and friction measureme

✍ A. Gough 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 158 KB

Stress Transmission During the Compactio

✍ ROBERT A. DIMILIA; JAMES S. REED 📂 Article 📅 1983 🏛 John Wiley and Sons 🌐 English ⚖ 582 KB

Measurement and analysis of the stress d

✍ Wensrich, C. M.; Kisi, E. H.; Zhang, J. F.; Kirstein, O. 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 866 KB

Phenomena at the powder-wall boundary du

✍ S. Strijbos 📂 Article 📅 1980 🏛 Elsevier Science ⚖ 595 KB

Phenomena at the powder-wall boundary du

✍ S. Strijbos 📂 Article 📅 1985 🏛 Elsevier Science 🌐 English ⚖ 134 KB