Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process

✍ Scribed by Wei Wang; Ya-Bing Li; Yong-Lei Li

• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 398 KB
• Volume: 255
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/j.apsusc.2008.11.057