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Intermetallic phase formation in diffusion-bonded Cu/Al laminates

✍ Scribed by Yajie Guo; Guiwu Liu; Haiyun Jin; Zhongqi Shi; Guanjun Qiao

Publisher
Springer
Year
2010
Tongue
English
Weight
365 KB
Volume
46
Category
Article
ISSN
0022-2461

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Solid-state reactive diffusion between Ti and Al was investigated in the temperature range of 520-650 β€’ C by employing multi-laminated Ti/Al diffusion couples. In samples annealed up to 150 h intermetallic TiAl 3 is the only phase observed in the diffusion zone and the preferential formation of this