Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces : Bi-Shio Chiouet al. IEEE Trans. Compon. Hybrids mfg Technol.13(2), 267 (1990)

• Book ID: 103284439
• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 135 KB
• Volume: 32
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(92)90117-4