✦ LIBER ✦
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board
✍ Scribed by Chi-pu Lin; Chih-ming Chen
- Book ID
- 107455494
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 828 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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